Sponsor Societies

Contact Person: Norbert Wehn
Location: Kapeldreef 75 c/o Imec
3001 Leuven
Website: https://www.edaa.com/

EDAA pursues educational, scientific and technical activities to the benefit of the international community of electronic design and design automation.

It organizes, across Europe, a series of highly qualified technical international conferences and workshops in the field of design and design automation of electronic circuits and systems.

Contact Person: Robert Smith
Location: 673 South Milpitas Blvd.
Milpitas, CA 95035
United States
Website: http://esd-alliance.org/

The Electronic System Design Alliance (ESD Alliance), an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry.

Contact Person: Kartik Patel
Website: https://www.ieee-ceda.org/

The Council on Electronic Design Automation (CEDA) was established to foster design automation of electronic circuits and systems at all levels. The Council's field of interest spans the theory, implementation, and use of EDA/CAD tools to design integrated electronic circuits and systems. This includes tools that automate all levels of the design, analysis, and verification of hardware and embedded software up to and including complete working systems. CEDA enables the exchange of technical information by sponsoring publications, conferences and workshops and through local chapters for volunteers activities.

If you are interested please contact admin@ieee-ceda.com or check our website for more information about our activities and how to become a member for free.

Contact Person: Adam Morawiec
Location: 47, chemin de la Croze
38690 Belmont
Website: https://ecsi.org/

ECSI is a European non-profit association, established in 1993 by large industrial developers of electronic systems, manufacturers of integrated circuits in Europe and major EDA companies. ECSI operates via collaborative research and development projects that address specific issues in the system design domain. Current projects include CONTREX, CRAFTERS, OpenES, and PaPP.

ECSI organizes yearly conferences: FDL, DASIP, ESLsyn, and DVCon Europe, as well as focused workshops devoted to provide a complete overview of advanced topics, emerging methods, and standards in system design. ECSI is also a proud DATE sponsor.

An important activity of ECSI is related to standardization in the domain of system design. ECSI established relations with the most important international standardization bodies to facilitate the access to information, support the standardization process and adoption of standards: IEEE/DASC, OCP, Si2, Accellera, OMG.

ECSI offers several membership options, whether a company or an individual, to help give you an influence on system design methods and standards. ECSI members are the backbone of our association and we will work closely with you to accommodate your needs and ideas. Please contact us at office@ecsi.org for more information.

Website: https://www.sigda.org/

SIGDA is committed to advancing the skills and knowledge of electronic design automation professionals and students throughout the world by

  • sponsoring and organizing international workshops, symposia and conferences
  • leading the way in capturing archival electronic design automation publications
  • providing travel grants to sponsored workshops, symposia and conferences
  • pioneering the maintenance and distribution of electronic design automation benchmarks
  • hosting university and government researchers for software demonstrations at the University Research Demonstration at DAC
  • publishing the SIGDA Newsletter
  • maintaining a World Wide Web access site on Internet
  • creating the webinar series SIGDA LIVE
  • initiating the new ACM Transactions on Design Automation of Electronic Systems
Location: prospekt Leninskiy, 32а
Website: http://www.ras.ru/

Technical Co-Sponsors

  • IEEE Computer Society Test Technology Technical Council [TTTC]
  • IEEE Solid-State Circuits Society [SSCS]
  • International Federation for Information Processing [IFIP]

Event Sponsors

Location: 46 avenue Félix Viallet
38031 Grenoble Cedex 1
Website: http://www.grenoble-inp.fr/
Website: https://www.inria.fr/

Inria is the French national research institute for the digital sciences. World-class research and technological innovation are part of our DNA, with the aim of developing and supporting scientific and entrepreneurial projects that create value for France, within a European perspective.

Corporate Sponsors

Location: Ungererstr. 69
80805 München
Website: aid-driving.eu

AID-Autonomous Intelligent Driving is bringing together the world's top software, robotics, AI and automotive talents to build a future where autonomous driving is embraced by humans. By understanding the human challenges as well as the engineering ones, the technology we are testing today on the streets of Munich will become the backbone of a universal self-driving system – capable of improving life in urban environments for millions of people. With the agility of a start-up and the support of Audi (VW Group), AID is free to craft an autonomous world that works for everyone – from manufacturers to passengers, from city planners to pedestrians. For us, the future isn't about merely making vehicles more autonomous, it's about making people more autonomous.

To find out more, please visit aid-driving.eu

Contact Person: Michael Tchagaspanian
Location: 17 rue des Martyrs
38054 Grenoble Cedex 9
Website: http://www.leti-cea.com/

Leti, a technology research institute at CEA Tech, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry.
Founded in 1967, Leti pioneers micro- & nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti's multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities.
With a staff of more than 1,900, a portfolio of 2,700 patents, 10,000 sq. m. of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo.
CEA-Leti has launched 65 startups and is a member of the Carnot Institutes network.
Follow us on www.leti-cea.com and @CEA_Leti.

Discover the most innovative demonstrators about advanced design & solutions for cyber physical systems, achieved by the Leti's & List's researchers:

P-Link: millimeter-wave radio signals, high-data through plastic media https://youtu.be/0nJn-VfWaEM

Contact Person: Johanna Castan
Location: 2 Boulevard Thomas Gobert
91120 Palaiseau
Website: http://www-list.cea.fr/

List, a CEA Tech institute, carries out research on smart digital systems. Its R&D programs, all with potentially major economic and social implications, focus on advanced manufacturing, cyberphysical systems, artificial intelligence and technologies for digital patient. By developing cutting-edge technological research, the List helps its industrial partners to enhance their competitiveness through innovation and technology transfer.

Discover the most innovative demonstrators about advanced design & solutions for cyber physical systems, achieved by the Leti's & List's researchers:

SESAM, a fully-integrated CPS design platform

SPIRIT, spiking neural networks, parallel, low-power & low-latency computation

RETINE, programmable vision chip, high frame rate and low latency image analysishttps://bit.ly/35DWbYA

Contact Person: Anton Klotz
Location: Cadence Design Systems GmbH
Mozartstr. 2
85622 Feldkirchen
Website: Cadence Academic Network

The aim of Cadence Academic Network is to promote the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence. A knowledge network among selected universities, research institutes, industry advisors and Cadence established to facilitate the sharing of technology expertise in the areas of verification, design and implementation of microelectronic systems.

Cadence Academic Network is sponsoring the DATE Interactive Presentations (IPs) again.

Contact Person: Kartik Patel
Website: https://www.ieee-ceda.org/

The Council on Electronic Design Automation (CEDA) was established to foster design automation of electronic circuits and systems at all levels. The Council's field of interest spans the theory, implementation, and use of EDA/CAD tools to design integrated electronic circuits and systems. This includes tools that automate all levels of the design, analysis, and verification of hardware and embedded software up to and including complete working systems. CEDA enables the exchange of technical information by sponsoring publications, conferences and workshops and through local chapters for volunteers activities.

If you are interested please contact admin@ieee-ceda.com or check our website for more information about our activities and how to become a member for free.

Contact Person: Romain Xu-Darme
Location: 100 rue des Mathématiques
38610 Gières
Website: https://cybersecurity.univ-grenoble-alpes.fr/

The rise of cyberattacks constitutes a major challenge for our societies, with an estimated cost of $6 trillion per year by 2021 (Forbes). In addition to their disastrous economic and social impact, these attacks weaken the confidence of citizens in the digital transition of activities and cause serious international tensions. As a consequence, the development of new sustainable solutions that enable end-to-end security, privacy and infrastructure resilience is now a multi-dimension challenge: technical, business, scientific and social.
The Grenoble Alpes Cybersecurity Institute – in short, Cyber@Alps – aims at undertaking ground-breaking interdisciplinary research in order to address these cybersecurity and privacy protection challenges. Our main technical focus are on cost effective secure elements, security of critical infrastructures all along their life cycle, vulnerability analysis and global challenges in terms of risk analysis and validation of large systems, including practical resilience across the industry and the society. Our approach to cybersecurity is holistic, encompassing technical, legal, law-enforcement, economic, social, diplomatic, military and intelligence-related aspects with strong partnerships with the private sector and robust national and international cooperation with leading institutions in France and abroad.

Contact Person: Xia Yanqiu
Location: Huawei Base, Bantian
Longgang Qu
Shenzhen Shi
Guangdong Sheng, 518129
Website: http://www.hisilicon.com/

HiSilicon is a global leading fabless semiconductor and IC design company that is dedicated to providing comprehensive connectivity and multimedia chipset solutions. As a prominent industry leader, HiSilicon paves the way for innovations in global connectivity and end-to-end ultra-HD video technologies.

From high-speed communications, smart devices, and IoT to video applications, HiSilicon chipsets and solutions have been proven and certified in more than 100 countries and regions in the world.

Headquartered in Shenzhen, China, HiSilicon has over 7,000 employees in offices and research centers in Beijing, Shanghai, Chengdu, Wuhan, Singapore, South Korea, Japan, Europe and other regions across the world. After 20 years of research and development, HiSilicon has built up a strong portfolio of IC design and verification technologies, developed an advanced EDA design platform, and is responsible for the setup of several development processes and regulations. Over the years, HiSilicon has successfully developed more than 200 models with proprietary IPR and filed over 8,000 patents. HiSilicon has also established strategic partnerships with global leaders in the ecosystem, specifically for engineering (wafer manufacturing), packaging, and testing within a reliable supply chain.

The mission of HiSilicon is to provide the best-quality solutions and services with a prompt response to our customers – HiSilicon is customer-centric and is always committed to creating values for our customers.

Contact Person: Yulia Sandamirskaya
Location: Lilienthalstraße 15
85579 Neubiberg
Website: https://www.intel.com/

Intel is the largest semiconductor chip maker with platforms designed to work together - seamless, connected and puts the user at the center. The range of computing products based on Intel® architecture goes beyond PCs and servers and extends to tablets, consumer electronics devices, and more. Over the last decade, Intel has evolved from a company that largely serves the PC industry, to a company that increasingly provides the vital intelligence inside all things computing. Hardware and software products by Intel power most of the world's data centers, connect hundreds of millions of cellular handsets and help secure and protect computers, mobile devices and corporate and government IT systems. Intel Labs Europe (ILE) is a central division within Intel that deals with research-oriented topics, which are supposed to be brought into future Intel products in a three to ten years timeframe. ILE has a worldwide presence and has some important Labs in Europe, among which the ones in Germany (Munich, Karlsruhe and Darmstadt). ILE deals with medium and long-term research related topics like quantum computing, Artificial Intelligence (AI), dependable systems, autonomous driving, and security and safety, among others.

Contact Person: Didier Louis / François Legrand
Location: 17 rue des Martyrs
38054 Grenoble cedex 9
Website: http://www.irtnanoelec.fr/en/

Nanoelec Research Technological Institute (IRT), headed by CEA-Leti, conducts research and development in the field of information and communication technologies (ICT) and, specifically, micro- and nanoelectronics. Based in Grenoble, France, IRT Nanoelec leverages the area's proven innovation ecosystem to create the technologies that will power the nanoelectronics of tomorrow, drive new product development and inspire new applications. The R&D conducted at IRT Nanoelec provides early insight into how emerging technologies will affect integrated circuits.

IRT Nanoelec pursues three objectives: The first is technology development for future generations of integrated circuits. Our researches are main focused on 3D integrated circuits, silicon photonics, power devices and characterization, currently IRT Nanoelec's four silicon-based technology research programs.

Our second objective is to transfer new technologies to businesses through the 2 IRT Nanoelec diffusion programs. The capacity to translate research into marketable products is a much more relevant way to assess our capacity for innovation.

Finally, our third objective is to create new educational and training programs and content that meet the future human resources needs expressed by IRT Nanoelec's industrial partners. We also strive to ensure that learners who complete IRT Nanoelec courses have acquired the skills necessary for successful career placement. Visit www.irtnanoelec.fr

IRT Nanoelec sponsored a Friday Workshop in line with DATE 2020 that was finally presented to registered participants as a webinar on 13 March 2020. This workshop introduced IRT Nanoelec as a key player in Grenoble ecosystem by sharing results and vision on imaging solutions, photonic components and cyber security innovations. Please find additional content and material of the workshop here: http://www.irtnanoelec.fr/actualites/bridging-the-gap-between-semiconductor-technologies-and-architecture-date20/

Contact Person: Astrid Ernst, Marketing Europe
Website: https://www.mentor.com/

Mentor, a Siemens business, enables companies to develop better electronic products faster and more cost-effectively, where today's design meets tomorrow. Our innovative products and solutions empower engineers to conquer design challenges in the increasingly complex worlds of board and chip design. We are a global leader in electronic design automation, providing products, consulting services and award-winning support for the world's most successful electronics systems and semiconductor companies.

Mentor offers the broadest industry portfolio of best-in-class hardware and software design solutions focused on C-based design and hardware/software co-verification, IC design and physical verification, functional verification, FPGA/PLD, design-for-test, PCB design and embedded software.

Contact Person: Marcello Coppola
Location: 12 rue Jules Horowitz
39019 Grenoble Cedex
Website: http://www.st.com/

ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices.

By getting more from technology to get more from life, ST stands for life.augmented.

The Company serves more than 100,000 customers worldwide. Further information can be found at www.st.com

Website: https://www.synopsys.com/

Synopsys, Inc (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. Customers around the world trust our electronic design automation (EDA) technology and silicon IP solutions to create state-of-the-art chips for amazing things from smartphones to self-driving cars to machines that learn. And they use our industry-leading software testing tools and services to develop high-quality code that is secure in cyberspace. Our commitment to making technology smarter and safer is powering the new era of Smart Everything and transforming the way people live, work, and play. Learn more at www.synopsys.com.

Media Partners

Contact Person: DAC Exhibits Team
Location: Moscone West
San Francisco, CA 94103
United States
Website: https://www.dac.com/

Get ready for the 57th DAC to be held in San Francisco, California, July 19 - 23, 2020. Continuing the tradition of being in the forefront of electronic design, the 57th DAC will offer outstanding training and education as well as superb networking opportunities. Check out www.dac.com.

Location: China National Convention Center
No.7 Tianchen East Road
Chaoyang Qu
Beijing Shi, 100105
Website: www.aspdac.com

ASP-DAC 2020 is the 25th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC.

General Information

Date: January 13-16, 2020
Place: China National Convention Center (CNCC), Beijing, China
Submission of Papers / Design Descriptions:

  • Deadline for submission: 5 PM AOE (Anywhere on Earth) Friday, July 5, 2019
  • Notification of acceptance: Monday, September 9, 2019
  • Deadline for final version: 5 PM AOE (Anywhere on earth) Monday, November 4, 2019


Registration to the 25th Asia and South Pacific Design Automation Conference is possible via the ASP-DAC 2020 webpage.

Location: WIN-Verlag GmbH & Co. KG
Johann-Sebastian-Bach-Str. 5
85591 Vaterstetten
Website: AutoCAD & Inventor Magazin

AutoCAD & Inventor Magazin covers more than just IT subjects - we report on all aspects of professional life that are important for constructing engineers and planners. We focus especially on innovations in drive technology, automation technology, connectivity, construction components, fluid technology, electrical engineering and materials.

Homepage: www.autocad-magazin.de

Location: 496 Salmar Ave
Campbell, CA 95008
United States
Website: https://www.edacafe.com/

EDACafe.Com is the #1 EDA web portal. Thousands of IC, FPGA and System designers visit EDACafé.com to learn the latest news and research design tools and services. The sites attract more than 75,000 unique visitors each month and leverages TechJobsCafé.com to bring you job opportunities targeted to engineering and design. And daily e-newsletters reach more than 40,000 engineering professionals. For more details visit www.EDACafe.com and www.TechJobsCafe.com.

Location: Messe München
Am Messesee
81823 Munich
Website: https://www.semiconeuropa.org/

10 - 13 November 2020

SEMICON Europa is the annual premier event for the global electronics industry in Europe. The event covers new products and technologies for electronics design and manufacturing, and features technologies from across the electronics supply chain, from electronic design automation to device fabrication (wafer processing) to final manufacturing (assembly, packaging, and test). SEMICON Europa also features emerging markets and technologies, including MEMS and flexible electronics, and a wide range of products, including power electronics, sensors, organic and flexible electronics, imaging devices, bioelectronics, automotive, and other exciting new technologies.

An der Frauenkirche 5
01067 Dresden
Website: 3D & Systems Summit

Expanding Application Space
27–29 January 2020

The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D roadmap, Heterogeneous Integration and System-In-Package manufacturing.

The brand new agenda will focus on disruptive applications like Mobile IoT, High Reliability and High Performance. Invited high-caliber speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.

Location: World Trade Center WTC
5-7 Place Robert Schuman
38000 Grenoble
Website: MEMS & Imaging Sensors Summit

22–24 June 2020

MEMS, imaging and sensors devices are driving innovation and causing demand to explode in transportation, medical, mobile, industrial and other Internet of Things (IoT) applications. Join the summit to boost your business opportunities, discover more about system integration success stories and responses to demand for data analytics, in particular Artificial Intelligence, being enabled by sensor data collection.